S9S08AW32MFDE
vs
MC9S08AW16MFDE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
7 X 7 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, MO-220VKKD-2, QFN-48
7 X 7 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, MO-220VKKD-2, QFN-48
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
40 MHz
40 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
S-XQCC-N48
S-XQCC-N48
Length
7 mm
7 mm
Number of I/O Lines
54
54
Number of Terminals
48
48
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
VQCCN
VQCCN
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, VERY THIN PROFILE
CHIP CARRIER, VERY THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
FLASH
FLASH
Seated Height-Max
1 mm
1 mm
Speed
40 MHz
40 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
2.7 V
2.7 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
7 mm
7 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
2
3
Pbfree Code
Rohs Code
Part Package Code
QFN
Pin Count
48
Moisture Sensitivity Level
3
On Chip Program ROM Width
8
Package Equivalence Code
LCC48,.27SQ,20
Peak Reflow Temperature (Cel)
260
RAM (bytes)
1024
ROM (words)
16384
Time@Peak Reflow Temperature-Max (s)
40
Compare S9S08AW32MFDE with alternatives
Compare MC9S08AW16MFDE with alternatives