S87C751-4F24
vs
S83C752-1N28
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
DIP, DIP24,.3
|
DIP, DIP28,.6
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Bit Size |
8
|
8
|
| CPU Family |
8051
|
8051
|
| JESD-30 Code |
R-XDIP-T24
|
R-PDIP-T28
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
24
|
28
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP24,.3
|
DIP28,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
64
|
64
|
| ROM (words) |
2048
|
2048
|
| ROM Programmability |
UVPROM
|
MROM
|
| Speed |
16 MHz
|
12 MHz
|
| Supply Current-Max |
22 mA
|
20 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
2
|
|
|
|