S83C751-2N24
vs
S83C752-1A28
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP, DIP24,.3
QCCJ, LDCC28,.5SQ
Pin Count
24
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
Additional Feature
I2C SERIAL BUS INTERFACE
Address Bus Width
Bit Size
8
8
Boundary Scan
NO
CPU Family
8051
8051
Clock Frequency-Max
12 MHz
DAC Channels
NO
DMA Channels
NO
External Data Bus Width
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
R-PDIP-T24
S-PQCC-J28
Length
31.7 mm
Low Power Mode
YES
Moisture Sensitivity Level
1
Number of DMA Channels
Number of External Interrupts
2
Number of I/O Lines
19
Number of Serial I/Os
1
Number of Terminals
24
28
Number of Timers
2
On Chip Data RAM Width
8
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
PWM Channels
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
QCCJ
Package Equivalence Code
DIP24,.3
LDCC28,.5SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
64
64
RAM (words)
64
ROM (words)
2048
2048
ROM Programmability
OTPROM
MROM
Seated Height-Max
4.7 mm
Speed
12 MHz
12 MHz
Supply Voltage-Max
5.5 V
Supply Voltage-Min
5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
J BEND
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Width
7.62 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Base Number Matches
3
2
JESD-609 Code
e0
Supply Current-Max
20 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Compare S83C751-2N24 with alternatives