S83C51FB-24
vs
LP87C51FB-24
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Part Package Code |
QFP
|
DIP
|
Package Description |
QFP-44
|
PLASTIC, DIP-40
|
Pin Count |
44
|
40
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
NO
|
NO
|
Address Bus Width |
16
|
16
|
Bit Size |
8
|
8
|
Boundary Scan |
NO
|
NO
|
CPU Family |
8051
|
8051
|
Clock Frequency-Max |
24 MHz
|
24 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
S-PQFP-G44
|
R-PDIP-T40
|
Length |
10 mm
|
52.26 mm
|
Number of I/O Lines |
32
|
32
|
Number of Terminals |
44
|
40
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
DIP
|
Package Equivalence Code |
QFP44,.5SQ,32
|
DIP40,.6
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLATPACK
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
256
|
256
|
ROM (words) |
16384
|
16384
|
ROM Programmability |
MROM
|
OTPROM
|
Seated Height-Max |
2.35 mm
|
5.08 mm
|
Speed |
24 MHz
|
24 MHz
|
Supply Current-Max |
56 mA
|
56 mA
|
Supply Voltage-Max |
6 V
|
6 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
0.8 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
10 mm
|
15.24 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
|
|
|
Compare S83C51FB-24 with alternatives
Compare LP87C51FB-24 with alternatives