S82S131F vs N82S130NB feature comparison

S82S131F NXP Semiconductors

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N82S130NB Philips Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS SIGNETICS CORP
Package Description , DIP, DIP16,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Memory IC Type OTP ROM OTP ROM
Qualification Status Not Qualified Not Qualified
Base Number Matches 3 3
Rohs Code No
Access Time-Max 50 ns
JESD-30 Code R-PDIP-T16
JESD-609 Code e0
Memory Density 2048 bit
Memory Width 4
Number of Functions 1
Number of Terminals 16
Number of Words 512 words
Number of Words Code 512
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 75 °C
Operating Temperature-Min
Organization 512X4
Output Characteristics OPEN-COLLECTOR
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Supply Current-Max 0.14 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL

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