S8200F vs N8201N feature comparison

S8200F NXP Semiconductors

Buy Now Datasheet

N8201N NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP SIGNETICS CORP
Package Description , DIP, DIP24,.6
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 82 82
JESD-30 Code R-GDIP-T24 R-PDIP-T24
Load Capacitance (CL) 18 pF 18 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 5 5
Number of Functions 2 2
Number of Terminals 24 24
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -55 °C
Output Polarity TRUE INVERTED
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 110 mA 110 mA
Propagation Delay (tpd) 45 ns 45 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL EXTENDED
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE NEGATIVE EDGE
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Package Equivalence Code DIP24,.6
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm

Compare S8200F with alternatives

Compare N8201N with alternatives