S80C186EB-25
vs
SB80C186EB13
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
INTEL CORP
Part Package Code
QFP
QFP
Package Description
EIAJ, QFP-80
SHRINK, QFP-80
Pin Count
80
80
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
20
20
Bit Size
16
16
Boundary Scan
NO
NO
Clock Frequency-Max
50 MHz
26 MHz
External Data Bus Width
16
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
R-PQFP-G80
S-PQFP-G80
JESD-609 Code
e0
e0
Length
20 mm
12 mm
Low Power Mode
YES
YES
Number of DMA Channels
Number of External Interrupts
6
Number of Serial I/Os
2
Number of Terminals
80
80
On Chip Data RAM Width
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
LFQFP
Package Equivalence Code
QFP80,.7X.9,32
QFP80,.55SQ,20
Package Shape
RECTANGULAR
SQUARE
Package Style
FLATPACK
FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Seated Height-Max
3.15 mm
1.66 mm
Speed
25 MHz
13 MHz
Supply Current-Max
115 mA
73 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
14 mm
12 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
2
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supplies
5 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare S80C186EB-25 with alternatives
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