S80960SA-10 vs TSB80C186EA25 feature comparison

S80960SA-10 Intel Corporation

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TSB80C186EA25 Intel Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Part Package Code QFP QFP
Package Description QFP, QFP80,.7X.9,32 LFQFP,
Pin Count 80 80
Reach Compliance Code compliant unknown
Additional Feature OPTEMP SPECIFIED AS TC; REGISTER SCOREBOARDING; BURST BUS DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; NUMERIC COPROCESSOR INTERFACE
Address Bus Width 32 20
Bit Size 32 16
Boundary Scan NO NO
Clock Frequency-Max 20 MHz 50 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code R-PQFP-G80 S-PQFP-G80
JESD-609 Code e0
Low Power Mode NO YES
Number of DMA Channels 2
Number of External Interrupts 4 5
Number of Serial I/Os
Number of Terminals 80 80
On Chip Data RAM Width
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP LFQFP
Package Equivalence Code QFP80,.7X.9,32
Package Shape RECTANGULAR SQUARE
Package Style FLATPACK FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies 5 V
Qualification Status Not Qualified Not Qualified
RAM (words) 0 0
Speed 10 MHz 25 MHz
Supply Current-Max 240 mA 105 mA
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 1 1
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Length 12 mm
Seated Height-Max 1.7 mm
Width 12 mm

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