S71WS512RE0HH30T0 vs S29WS256R0PBHW402 feature comparison

S71WS512RE0HH30T0 Spansion

Buy Now Datasheet

S29WS256R0PBHW402 Spansion

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code BGA BGA
Package Description TFBGA, BGA84,10X12,32 VFBGA,
Pin Count 84 84
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 80 ns
JESD-30 Code R-PBGA-B84 R-PBGA-B84
Length 11.6 mm 11.6 mm
Memory Density 536870912 bit 536870912 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Mixed Memory Type FLASH+PSRAM
Number of Functions 1 1
Number of Terminals 84 84
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -30 °C -25 °C
Organization 32MX16 32MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA VFBGA
Package Equivalence Code BGA84,10X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Programming Voltage 1.8 V 1.8 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 8 mm 8 mm
Base Number Matches 2 1
Additional Feature SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE, BOTTOM BOOT BLOCK
Boot Block BOTTOM

Compare S71WS512RE0HH30T0 with alternatives

Compare S29WS256R0PBHW402 with alternatives