S71WS512NC0BFWAP2 vs S71WS512NC0BAWAP2 feature comparison

S71WS512NC0BFWAP2 Spansion

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S71WS512NC0BAWAP2 AMD

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code BGA
Package Description 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84 FBGA, BGA84,10X12,32
Pin Count 84
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 80 ns 80 ns
Additional Feature PSRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE
JESD-30 Code R-PBGA-B84 R-PBGA-B84
JESD-609 Code e1
Length 11.6 mm
Memory Density 536870912 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16
Mixed Memory Type FLASH+PSRAM FLASH+PSRAM
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 84 84
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 32MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA FBGA
Package Equivalence Code BGA84,10X12,32 BGA84,10X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Standby Current-Max 0.00007 A 0.00004 A
Supply Current-Max 0.054 mA 0.066 mA
Supply Voltage-Max (Vsup) 1.95 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 8 mm
Base Number Matches 3 2

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