S71PL129JB0BAWQB2
vs
S71PL127JA0BAW9Z3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SPANSION INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
Package Description
TFBGA,
Pin Count
64
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.71
Additional Feature
PSRAM IS ORGANIZED AS 2M X 16
JESD-30 Code
R-PBGA-B64
R-PBGA-B64
JESD-609 Code
e0
Length
11.6 mm
Memory Density
134217728 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
64
64
Number of Words
8388608 words
Number of Words Code
8000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-25 °C
-25 °C
Organization
8MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
FBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
8 mm
Base Number Matches
1
3
Access Time-Max
70 ns
Mixed Memory Type
FLASH+PSRAM
Package Equivalence Code
BGA64,10X12,32
Power Supplies
3 V
Standby Current-Max
0.000005 A
Supply Current-Max
0.07 mA
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