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S71PL064JA0BFW074 vs S71PL064JA0BFW070 feature comparison

S71PL064JA0BFW074 AMD

Buy Now Datasheet

S71PL064JA0BFW070 AMD

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC ADVANCED MICRO DEVICES INC
Package Description FBGA, BGA56,8X8,32 FBGA, BGA56,8X8,32
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 65 ns 70 ns
JESD-30 Code S-PBGA-B56 S-PBGA-B56
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Mixed Memory Type FLASH+PSRAM FLASH+PSRAM
Number of Terminals 56 56
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Equivalence Code BGA56,8X8,32 BGA56,8X8,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.07 mA 0.07 mA
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Base Number Matches 2 2
Standby Current-Max 0.000005 A
Supply Voltage-Nom (Vsup) 3 V
Memory » Other Memory ICs
Memory » Other Memory ICs