S71PL064J08BFI0P4
vs
S71PL064J08BFI0P2
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SPANSION INC
|
ADVANCED MICRO DEVICES INC
|
Part Package Code |
BGA
|
|
Package Description |
TFBGA,
|
FBGA, BGA56,8X8,32
|
Pin Count |
56
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Additional Feature |
STATIC RAM IS ORGANIZED AS 512K X 16
|
|
JESD-30 Code |
R-PBGA-B56
|
S-PBGA-B56
|
JESD-609 Code |
e1
|
|
Length |
9 mm
|
|
Memory Density |
67108864 bit
|
|
Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
Memory Width |
16
|
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
|
Number of Terminals |
56
|
56
|
Number of Words |
4194304 words
|
|
Number of Words Code |
4000000
|
|
Operating Mode |
ASYNCHRONOUS
|
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
4MX16
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
FBGA
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
|
Supply Voltage-Min (Vsup) |
2.7 V
|
|
Supply Voltage-Nom (Vsup) |
3 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
7 mm
|
|
Base Number Matches |
2
|
2
|
Access Time-Max |
|
65 ns
|
Mixed Memory Type |
|
FLASH+SRAM
|
Package Equivalence Code |
|
BGA56,8X8,32
|
Supply Current-Max |
|
0.07 mA
|
|
|
|
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