S71PL064J08BAW0P4
vs
S71PL064J08BFW0P3
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SPANSION INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
BGA
|
|
| Package Description |
TFBGA,
|
FBGA, BGA56,8X8,32
|
| Pin Count |
56
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Additional Feature |
STATIC RAM IS ORGANIZED AS 512K X 16
|
|
| JESD-30 Code |
R-PBGA-B56
|
S-PBGA-B56
|
| JESD-609 Code |
e0
|
|
| Length |
9 mm
|
|
| Memory Density |
67108864 bit
|
|
| Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
| Memory Width |
16
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
56
|
56
|
| Number of Words |
4194304 words
|
|
| Number of Words Code |
4000000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-25 °C
|
| Organization |
4MX16
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
FBGA
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7 mm
|
|
| Base Number Matches |
2
|
2
|
| Access Time-Max |
|
65 ns
|
| Mixed Memory Type |
|
FLASH+SRAM
|
| Package Equivalence Code |
|
BGA56,8X8,32
|
| Supply Current-Max |
|
0.07 mA
|
|
|
|
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