S71PL032J40BAI0K3 vs S71PL032J40BFI0K0 feature comparison

S71PL032J40BAI0K3 Spansion

Buy Now Datasheet

S71PL032J40BFI0K0 AMD

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code BGA
Package Description TFBGA, BGA56,8X8,32 FBGA, BGA56,8X8,32
Pin Count 56
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 70 ns 70 ns
Additional Feature PSRAM IS ORGANIZED AS 256K X 16
JESD-30 Code R-PBGA-B56 S-PBGA-B56
JESD-609 Code e1
Length 9 mm
Memory Density 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16
Mixed Memory Type FLASH+PSRAM FLASH+PSRAM
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 56 56
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA FBGA
Package Equivalence Code BGA56,8X8,32 BGA56,8X8,32
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Standby Current-Max 0.000005 A 0.000005 A
Supply Current-Max 0.07 mA 0.07 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 7 mm
Base Number Matches 2 2

Compare S71PL032J40BAI0K3 with alternatives