S71PL032J04BFW0B0
vs
S71PL032J04BAI0B3
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
SPANSION INC
|
| Package Description |
,
|
TFBGA, BGA56,8X8,32
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
56
|
| Access Time-Max |
|
70 ns
|
| Additional Feature |
|
SRAM IS ORGANIZED AS 256K X 16
|
| JESD-30 Code |
|
R-PBGA-B56
|
| Length |
|
9 mm
|
| Memory Density |
|
33554432 bit
|
| Memory IC Type |
|
MEMORY CIRCUIT
|
| Memory Width |
|
16
|
| Mixed Memory Type |
|
FLASH+SRAM
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
56
|
| Number of Words |
|
2097152 words
|
| Number of Words Code |
|
2000000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
2MX16
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TFBGA
|
| Package Equivalence Code |
|
BGA56,8X8,32
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.2 mm
|
| Standby Current-Max |
|
0.000005 A
|
| Supply Current-Max |
|
0.07 mA
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
|
3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
7 mm
|
|
|
|
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