S71PL032J04BFI0K0
vs
S71GL064A0ABAW0F0
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
SPANSION INC
Package Description
FBGA, BGA56,8X8,32
TFBGA,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
70 ns
JESD-30 Code
S-PBGA-B56
R-PBGA-B56
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Mixed Memory Type
FLASH+SRAM
Number of Terminals
56
56
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-25 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
TFBGA
Package Equivalence Code
BGA56,8X8,32
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.000005 A
Supply Current-Max
0.07 mA
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
3
2
Part Package Code
BGA
Pin Count
56
Additional Feature
SRAM IS ORGANIZED AS 1M X 16
JESD-609 Code
e0
Length
9 mm
Memory Density
67108864 bit
Memory Width
16
Number of Functions
1
Number of Words
4194304 words
Number of Words Code
4000000
Operating Mode
ASYNCHRONOUS
Organization
4MX16
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.1 V
Supply Voltage-Min (Vsup)
2.7 V
Terminal Finish
TIN LEAD
Width
7 mm
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