S71PL032J04BAW0B3
vs
S71PL032J04BAI0B3
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
SPANSION INC
|
Package Description |
,
|
TFBGA, BGA56,8X8,32
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
Yes
|
Part Package Code |
|
BGA
|
Pin Count |
|
56
|
Access Time-Max |
|
70 ns
|
Additional Feature |
|
SRAM IS ORGANIZED AS 256K X 16
|
JESD-30 Code |
|
R-PBGA-B56
|
Length |
|
9 mm
|
Memory Density |
|
33554432 bit
|
Memory IC Type |
|
MEMORY CIRCUIT
|
Memory Width |
|
16
|
Mixed Memory Type |
|
FLASH+SRAM
|
Number of Functions |
|
1
|
Number of Terminals |
|
56
|
Number of Words |
|
2097152 words
|
Number of Words Code |
|
2000000
|
Operating Mode |
|
ASYNCHRONOUS
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
2MX16
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
TFBGA
|
Package Equivalence Code |
|
BGA56,8X8,32
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.2 mm
|
Standby Current-Max |
|
0.000005 A
|
Supply Current-Max |
|
0.07 mA
|
Supply Voltage-Max (Vsup) |
|
3.6 V
|
Supply Voltage-Min (Vsup) |
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
|
3 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
0.8 mm
|
Terminal Position |
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
7 mm
|
|
|
|
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