S71JL128HC0BFW01 vs MB84VD22184EE-90-PBS feature comparison

S71JL128HC0BFW01 AMD

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MB84VD22184EE-90-PBS FUJITSU Limited

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Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC FUJITSU LTD
Package Description LFBGA, BGA88,10X12,32 LFBGA, BGA73,10X12,32
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 70 ns 90 ns
Additional Feature SRAM IS ORGANISED AS 4KX16 ALSO INCLUDED 256K X 16 SRAM
JESD-30 Code R-PBGA-B88 R-PBGA-B73
Length 11.6 mm 11.6 mm
Memory Density 134217728 bit 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+PSRAM FLASH+SRAM
Number of Functions 1 1
Number of Terminals 88 73
Number of Words 8388608 words 2097152 words
Number of Words Code 8000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 8MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA88,10X12,32 BGA73,10X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 4 1
Part Package Code BGA
Pin Count 73
JESD-609 Code e0
Supply Current-Max 0.053 mA
Terminal Finish TIN LEAD

Compare S71JL128HC0BFW01 with alternatives

Compare MB84VD22184EE-90-PBS with alternatives