S71JL128HC0BFW01
vs
IS71V16F64GS08-8585AI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
INTEGRATED SILICON SOLUTION INC
Package Description
LFBGA, BGA88,10X12,32
11 X 12 MM, BGA-101
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
70 ns
85 ns
Additional Feature
SRAM IS ORGANISED AS 4KX16
SRAM ORGANISATION IS 512K X 16/1M X 8
JESD-30 Code
R-PBGA-B88
R-PBGA-B101
Length
11.6 mm
12 mm
Memory Density
134217728 bit
67108864 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Mixed Memory Type
FLASH+PSRAM
FLASH+SRAM
Number of Functions
1
1
Number of Terminals
88
101
Number of Words
8388608 words
4194304 words
Number of Words Code
8000000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-25 °C
-40 °C
Organization
8MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA88,10X12,32
BGA101,12X14,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
3.3 V
3.3 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
11 mm
Base Number Matches
4
1
Pbfree Code
Part Package Code
BGA
Pin Count
101
JESD-609 Code
e0
Standby Current-Max
0.000005 A
Supply Current-Max
0.053 mA
Terminal Finish
TIN LEAD
Compare S71JL128HC0BFW01 with alternatives
Compare IS71V16F64GS08-8585AI with alternatives