S71JL128HC0BFW01 vs AM42DL1632DT70FT feature comparison

S71JL128HC0BFW01 AMD

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AM42DL1632DT70FT Spansion

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Package Description LFBGA, BGA88,10X12,32 LFBGA,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 70 ns
Additional Feature SRAM IS ORGANISED AS 4KX16 SRAM IS ORGANISED AS 128K X 16
JESD-30 Code R-PBGA-B88 R-PBGA-B69
Length 11.6 mm 11 mm
Memory Density 134217728 bit 16777216 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+PSRAM
Number of Functions 1 1
Number of Terminals 88 69
Number of Words 8388608 words 1048576 words
Number of Words Code 8000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -40 °C
Organization 8MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA88,10X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 4 1
Part Package Code BGA
Pin Count 69
JESD-609 Code e1
Moisture Sensitivity Level 3
Terminal Finish TIN SILVER COPPER

Compare S71JL128HC0BFW01 with alternatives

Compare AM42DL1632DT70FT with alternatives