S71JL128HB0BAI00
vs
AM42DL3234GB71IT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
ADVANCED MICRO DEVICES INC
Package Description
LFBGA, BGA73,10X12,32
LFBGA, BGA73,10X12,32
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
55 ns
70 ns
Additional Feature
SRAM IS ORGANISED AS 2KX16
PSEUDO SRAM IS ORGANISED AS 256K X 16; FLASH CAN ALSO BE ORGANISED AS 4M X 8
JESD-30 Code
R-PBGA-B73
R-PBGA-B73
Length
11.6 mm
11.6 mm
Memory Density
134217728 bit
33554432 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Mixed Memory Type
FLASH+PSRAM
FLASH+SRAM
Number of Functions
1
1
Number of Terminals
73
73
Number of Words
8388608 words
2097152 words
Number of Words Code
8000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA73,10X12,32
BGA73,10X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
3.3 V
3.3 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
8 mm
Base Number Matches
1
3
Part Package Code
BGA
Pin Count
73
JESD-609 Code
e0
Supply Current-Max
0.045 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Compare S71JL128HB0BAI00 with alternatives
Compare AM42DL3234GB71IT with alternatives