S71JL064H80BAI122
vs
S71JL064H80BAI022
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
BGA
Package Description
LFBGA, BGA73,10X12,32
LFBGA, BGA73,10X12,32
Pin Count
73
73
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
85 ns
85 ns
Additional Feature
PSRAM IS ORGANIZED AS 512K X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8
SRAM IS ORGANIZED AS 512K X 16 / 1M X 8; FLASH CAN ALSO BE ORGANIZED AS 8M X 8
JESD-30 Code
R-PBGA-B73
R-PBGA-B73
Length
11.6 mm
11.6 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Mixed Memory Type
FLASH+PSRAM
FLASH+SRAM
Number of Functions
1
1
Number of Terminals
73
73
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
4MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA73,10X12,32
BGA73,10X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Supply Current-Max
0.045 mA
0.045 mA
Supply Voltage-Max (Vsup)
3.3 V
3.3 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
8 mm
8 mm
Base Number Matches
2
2
Compare S71JL064H80BAI122 with alternatives
Compare S71JL064H80BAI022 with alternatives