S71GL064NB0BFW0U3 vs S71PL064JA0BAI0P0 feature comparison

S71GL064NB0BFW0U3 Spansion

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S71PL064JA0BAI0P0 Spansion

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code BGA BGA
Package Description 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 TFBGA, BGA56,8X8,32
Pin Count 56 56
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature PSRAM IS ORGANIZED AS 2M X 16 PSRAM IS ORGANIZED AS 1M X 16
JESD-30 Code R-PBGA-B56 R-PBGA-B56
JESD-609 Code e1
Length 9 mm 9 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 56 56
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.1 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Width 7 mm 7 mm
Base Number Matches 2 3
Access Time-Max 70 ns
Mixed Memory Type FLASH+PSRAM
Package Equivalence Code BGA56,8X8,32
Standby Current-Max 0.000005 A
Supply Current-Max 0.07 mA

Compare S71GL064NB0BFW0U3 with alternatives

Compare S71PL064JA0BAI0P0 with alternatives