S71GL064AA0BFI0Z0
vs
S71PL064J08BFW0B3
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
ADVANCED MICRO DEVICES INC
|
Reach Compliance Code |
compliant
|
compliant
|
Base Number Matches |
3
|
3
|
Rohs Code |
|
Yes
|
Package Description |
|
FBGA, BGA56,8X8,32
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.32.00.71
|
Access Time-Max |
|
70 ns
|
JESD-30 Code |
|
S-PBGA-B56
|
Memory IC Type |
|
MEMORY CIRCUIT
|
Mixed Memory Type |
|
FLASH+SRAM
|
Number of Terminals |
|
56
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-25 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
FBGA
|
Package Equivalence Code |
|
BGA56,8X8,32
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY, FINE PITCH
|
Qualification Status |
|
Not Qualified
|
Standby Current-Max |
|
0.000005 A
|
Supply Current-Max |
|
0.07 mA
|
Supply Voltage-Nom (Vsup) |
|
3 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
OTHER
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
0.8 mm
|
Terminal Position |
|
BOTTOM
|
|
|
|