S71GL064AA0BFI0U0 vs S71PL064J80BFI070 feature comparison

S71GL064AA0BFI0U0 Spansion

Buy Now Datasheet

S71PL064J80BFI070 AMD

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code BGA
Package Description 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 FBGA, BGA56,8X8,32
Pin Count 56
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature PSRAM IS ORGANIZED AS 1M X 16
JESD-30 Code R-PBGA-B56 S-PBGA-B56
JESD-609 Code e1
Length 9 mm
Memory Density 67108864 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 56 56
Number of Words 4194304 words
Number of Words Code 4000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA FBGA
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.1 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 7 mm
Base Number Matches 3 2
Access Time-Max 70 ns
Mixed Memory Type FLASH+PSRAM
Package Equivalence Code BGA56,8X8,32
Standby Current-Max 0.000005 A
Supply Current-Max 0.07 mA

Compare S71GL064AA0BFI0U0 with alternatives