S71GL064A80BFI0P3 vs S71GL064A80BFW0P2 feature comparison

S71GL064A80BFI0P3 AMD

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S71GL064A80BFW0P2 Spansion

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Package Description FBGA, BGA56,8X8,32 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 100 ns
JESD-30 Code S-PBGA-B56 R-PBGA-B56
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Mixed Memory Type FLASH+PSRAM
Number of Terminals 56 56
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -25 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA TFBGA
Package Equivalence Code BGA56,8X8,32
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.000005 A
Supply Current-Max 0.06 mA
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL EXTENDED
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Base Number Matches 3 3
Part Package Code BGA
Pin Count 56
Additional Feature PSRAM IS ORGANIZED AS 512K X 16
JESD-609 Code e1
Length 9 mm
Memory Density 67108864 bit
Memory Width 16
Moisture Sensitivity Level 3
Number of Functions 1
Number of Words 4194304 words
Number of Words Code 4000000
Operating Mode ASYNCHRONOUS
Organization 4MX16
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.1 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 40
Width 7 mm

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