S71GL064A08BAW0B3 vs S71PL032J04BFI0F3 feature comparison

S71GL064A08BAW0B3 Spansion

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S71PL032J04BFI0F3 Spansion

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code BGA BGA
Package Description TFBGA, TFBGA, BGA56,8X8,32
Pin Count 56 56
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature SRAM IS ORGANIZED AS 512K X 16 SRAM IS ORGANIZED AS 256K X 16
JESD-30 Code R-PBGA-B56 R-PBGA-B56
JESD-609 Code e0 e1
Length 9 mm 9 mm
Memory Density 67108864 bit 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 56 56
Number of Words 4194304 words 2097152 words
Number of Words Code 4000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -40 °C
Organization 4MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.1 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 7 mm 7 mm
Base Number Matches 1 1
Access Time-Max 70 ns
Mixed Memory Type FLASH+SRAM
Moisture Sensitivity Level 3
Package Equivalence Code BGA56,8X8,32
Peak Reflow Temperature (Cel) 260
Standby Current-Max 0.000005 A
Supply Current-Max 0.07 mA
Time@Peak Reflow Temperature-Max (s) 40

Compare S71GL064A08BAW0B3 with alternatives

Compare S71PL032J04BFI0F3 with alternatives