S71GL032NA0BHW0Z2 vs S71AL016D02BFWTF3 feature comparison

S71GL032NA0BHW0Z2 Cypress Semiconductor

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S71AL016D02BFWTF3 AMD

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP ADVANCED MICRO DEVICES INC
Package Description 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56 FBGA, BGA56,8X8,32
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 90 ns 70 ns
Additional Feature PSRAM IS ORGANIZED AS 1M X 16
JESD-30 Code R-PBGA-B56 S-PBGA-B56
JESD-609 Code e1
Length 9 mm
Memory Density 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16
Mixed Memory Type FLASH+SRAM FLASH+SRAM
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 56 56
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA FBGA
Package Equivalence Code BGA56,8X8,32 BGA56,8X8,32
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.1 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 7 mm
Base Number Matches 2 2
Standby Current-Max 0.00002 A
Supply Current-Max 0.035 mA

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