S71GL032NA0BFW0Z2
vs
S71AL016D02BFWBF0
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
SPANSION INC
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
Package Description
7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
FBGA, BGA56,8X8,32
Pin Count
56
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
90 ns
70 ns
Additional Feature
PSRAM IS ORGANIZED AS 1M X 16
JESD-30 Code
R-PBGA-B56
S-PBGA-B56
JESD-609 Code
e1
Length
9 mm
Memory Density
33554432 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
Mixed Memory Type
FLASH+SRAM
FLASH+SRAM
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
56
56
Number of Words
2097152 words
Number of Words Code
2000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-25 °C
-25 °C
Organization
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
FBGA
Package Equivalence Code
BGA56,8X8,32
BGA56,8X8,32
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.1 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
7 mm
Base Number Matches
2
2
Standby Current-Max
0.00002 A
Supply Current-Max
0.035 mA
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