S71GL032NA0BFW0Z0 vs S71GL032N40BHW0K3 feature comparison

S71GL032NA0BFW0Z0 Spansion

Buy Now Datasheet

S71GL032N40BHW0K3 Spansion

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code BGA BGA
Package Description 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56
Pin Count 56 56
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature PSRAM IS ORGANIZED AS 1M X 16 PSRAM IS ORGANIZED AS 256K X 16
JESD-30 Code R-PBGA-B56 R-PBGA-B56
JESD-609 Code e1 e1
Length 9 mm 9 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 56 56
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.1 V 3.1 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 7 mm 7 mm
Base Number Matches 1 2

Compare S71GL032NA0BFW0Z0 with alternatives

Compare S71GL032N40BHW0K3 with alternatives