S71GL032N80BHW0P2 vs S71GL032NA0BFW0U0 feature comparison

S71GL032N80BHW0P2 Cypress Semiconductor

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S71GL032NA0BFW0U0 Spansion

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP SPANSION INC
Package Description TFBGA, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature PSRAM IS ORGANIZED AS 512K X 16 PSRAM IS ORGANIZED AS 1M X 16
JESD-30 Code R-PBGA-B56 R-PBGA-B56
Length 9 mm 9 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 56 56
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.1 V 3.1 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 7 mm 7 mm
Base Number Matches 2 1
Rohs Code Yes
Part Package Code BGA
Pin Count 56
JESD-609 Code e1
Moisture Sensitivity Level 3
Terminal Finish TIN SILVER COPPER

Compare S71GL032N80BHW0P2 with alternatives

Compare S71GL032NA0BFW0U0 with alternatives