S71GL032N80BHW0K3
vs
S71AL016D02BAWB73
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
SPANSION INC
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
|
Package Description |
7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56
|
|
Pin Count |
56
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.71
|
|
Additional Feature |
PSRAM IS ORGANIZED AS 512K X 16
|
|
JESD-30 Code |
R-PBGA-B56
|
|
JESD-609 Code |
e1
|
|
Length |
9 mm
|
|
Memory Density |
33554432 bit
|
|
Memory IC Type |
MEMORY CIRCUIT
|
|
Memory Width |
16
|
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
|
Number of Terminals |
56
|
|
Number of Words |
2097152 words
|
|
Number of Words Code |
2000000
|
|
Operating Mode |
ASYNCHRONOUS
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-25 °C
|
|
Organization |
2MX16
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
TFBGA
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.2 mm
|
|
Supply Voltage-Max (Vsup) |
3.1 V
|
|
Supply Voltage-Min (Vsup) |
2.7 V
|
|
Supply Voltage-Nom (Vsup) |
3 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
0.8 mm
|
|
Terminal Position |
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
7 mm
|
|
Base Number Matches |
1
|
3
|
|
|
|
Compare S71GL032N80BHW0K3 with alternatives