S71AL016D02BAWTF3
vs
S71AL016D02BAWT73
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
SPANSION INC
|
Package Description |
FBGA, BGA56,8X8,32
|
TFBGA,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Access Time-Max |
70 ns
|
|
JESD-30 Code |
S-PBGA-B56
|
R-PBGA-B56
|
Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
Mixed Memory Type |
FLASH+SRAM
|
|
Number of Terminals |
56
|
56
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-25 °C
|
-25 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FBGA
|
TFBGA
|
Package Equivalence Code |
BGA56,8X8,32
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Standby Current-Max |
0.00002 A
|
|
Supply Current-Max |
0.035 mA
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
2
|
3
|
Part Package Code |
|
BGA
|
Pin Count |
|
56
|
Additional Feature |
|
PSRAM IS ORGANIZED AS 128K X 16
|
JESD-609 Code |
|
e0
|
Length |
|
9 mm
|
Memory Density |
|
16777216 bit
|
Memory Width |
|
16
|
Number of Functions |
|
1
|
Number of Words |
|
1048576 words
|
Number of Words Code |
|
1000000
|
Operating Mode |
|
ASYNCHRONOUS
|
Organization |
|
1MX16
|
Seated Height-Max |
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
|
3.1 V
|
Supply Voltage-Min (Vsup) |
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
|
3 V
|
Terminal Finish |
|
TIN LEAD
|
Width |
|
7 mm
|
|
|
|
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