S70PL254J00BAW931 vs S29PL256N70GAW003 feature comparison

S70PL254J00BAW931 Spansion

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S29PL256N70GAW003 Cypress Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description TFBGA, BGA84,10X12,32 8 X 11.60 MM, LEAD FREE COMPLIANT, FBGA-84
Pin Count 84
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Boot Block BOTTOM/TOP
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-30 Code R-PBGA-B84 R-PBGA-B84
Length 11.6 mm 11.6 mm
Memory Density 268435456 bit 268435456 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Sectors/Size 32,508
Number of Terminals 84 84
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 16MX16 16MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA VFBGA
Package Equivalence Code BGA84,10X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Page Size 8 words
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES
Seated Height-Max 1.2 mm 1 mm
Sector Size 4K,32K
Standby Current-Max 0.000005 A
Supply Current-Max 0.07 mA
Supply Voltage-Max (Vsup) 3.6 V 3.1 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Toggle Bit YES
Type NOR TYPE NOR TYPE
Width 8 mm 8 mm
Base Number Matches 3 2
JESD-609 Code e0
Moisture Sensitivity Level 3
Terminal Finish TIN LEAD

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