S70GL02GS12FHIV23
vs
S70GL02GP11FAIR20
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
INFINEON TECHNOLOGIES AG
CYPRESS SEMICONDUCTOR CORP
Reach Compliance Code
compliant
compliant
Access Time-Max
120 ns
120 ns
Alternate Memory Width
8
8
Boot Block
BOTTOM/TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
R-PBGA-B64
R-PBGA-B64
Length
13 mm
13 mm
Memory Density
2147483648 bit
4294967296 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Sectors/Size
2K
Number of Terminals
64
64
Number of Words
134217728 words
268435456 words
Number of Words Code
128000000
256000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128MX16
256MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA64,8X8,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Page Size
16/32 words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.4 mm
1.4 mm
Sector Size
128K
Standby Current-Max
0.0002 A
Supply Current-Max
0.16 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
3 V
Supply Voltage-Nom (Vsup)
3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
YES
Type
NOR TYPE
NOR TYPE
Width
11 mm
11 mm
Base Number Matches
3
2
Package Description
13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64
ECCN Code
EAR99
HTS Code
8542.32.00.51
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare S70GL02GS12FHIV23 with alternatives
Compare S70GL02GP11FAIR20 with alternatives