S70GL02GP11FAIR10
vs
S70GL02GP11FFIR22
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
SPANSION INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
Package Description
13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64
13 X 11 MM, 1 MM PITCH, LEAD FREE, FORTIFIED, BGA-64
Pin Count
64
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.B.1.A
EAR99
HTS Code
8542.32.00.71
8542.32.00.51
Access Time-Max
110 ns
110 ns
Alternate Memory Width
8
8
Command User Interface
NO
Common Flash Interface
YES
Data Polling
NO
JESD-30 Code
R-PBGA-B64
R-PBGA-B64
JESD-609 Code
e0
e1
Length
13 mm
13 mm
Memory Density
4294967296 bit
4294967296 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Sectors/Size
2K
Number of Terminals
64
64
Number of Words
268435456 words
268435456 words
Number of Words Code
256000000
256000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256MX16
256MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA64,8X8,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Page Size
8/16 words
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.4 mm
1.4 mm
Sector Size
128K
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
NO
Type
NOR TYPE
NOR TYPE
Width
11 mm
11 mm
Base Number Matches
1
1
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