S70GL02GP11FACR23 vs S70GL02GS11FHI010 feature comparison

S70GL02GP11FACR23 Spansion

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S70GL02GS11FHI010 Cypress Semiconductor

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer SPANSION INC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description LBGA, FBGA-64
Pin Count 64
Reach Compliance Code unknown compliant
ECCN Code EAR99 3A991.B.1.A
HTS Code 8542.32.00.51 8542.32.00.71
Alternate Memory Width 8 8
JESD-30 Code R-PBGA-B64 R-PBGA-B64
Length 13 mm 13 mm
Memory Density 2147483648 bit 2147483648 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128MX16 128MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 11 mm 11 mm
Base Number Matches 1 1
Rohs Code Yes
Access Time-Max 110 ns
Boot Block BOTTOM/TOP
Command User Interface YES
Common Flash Interface YES
Data Polling YES
Number of Sectors/Size 2K
Package Equivalence Code BGA64,8X8,40
Page Size 16/32 words
Peak Reflow Temperature (Cel) NOT SPECIFIED
Ready/Busy YES
Sector Size 128K
Standby Current-Max 0.0002 A
Supply Current-Max 0.16 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Toggle Bit YES
Type NOR TYPE

Compare S70GL02GP11FACR23 with alternatives

Compare S70GL02GS11FHI010 with alternatives