S70GL02GP11FACR20
vs
S70GL02GP13FAIV23
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
SPANSION INC
SPANSION INC
Part Package Code
BGA
BGA
Package Description
LBGA,
13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-64
Pin Count
64
64
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Alternate Memory Width
8
8
JESD-30 Code
R-PBGA-B64
R-PBGA-B64
Length
13 mm
13 mm
Memory Density
2147483648 bit
4294967296 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
134217728 words
268435456 words
Number of Words Code
128000000
256000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
128MX16
256MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
11 mm
11 mm
Base Number Matches
2
1
Pbfree Code
Rohs Code
Access Time-Max
120 ns
Command User Interface
NO
Common Flash Interface
YES
Data Polling
NO
JESD-609 Code
e0
Moisture Sensitivity Level
3
Number of Sectors/Size
2K
Package Equivalence Code
BGA64,8X8,40
Page Size
8/16 words
Peak Reflow Temperature (Cel)
260
Ready/Busy
YES
Sector Size
128K
Terminal Finish
TIN LEAD
Toggle Bit
NO
Type
NOR TYPE
Compare S70GL02GP11FACR20 with alternatives
Compare S70GL02GP13FAIV23 with alternatives