S54S08F883B vs SN74S08DG4 feature comparison

S54S08F883B Philips Semiconductors

Buy Now Datasheet

SN74S08DG4 Rochester Electronics LLC

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer SIGNETICS CORP ROCHESTER ELECTRONICS LLC
Package Description DIP, DIP14,.3 SOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family S S
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0
Logic IC Type AND GATE AND GATE
Max I(ol) 0.02 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Power Supply Current-Max (ICC) 14.25 mA
Prop. Delay@Nom-Sup 7.5 ns
Propagation Delay (tpd) 7.5 ns 7.5 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Screening Level MIL-STD-883 Class B
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 3 2
Length 8.65 mm
Seated Height-Max 1.75 mm
Width 3.9 mm

Compare S54S08F883B with alternatives

Compare SN74S08DG4 with alternatives