S54LS158F
vs
SN54LS158J
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
MOTOROLA INC
Package Description
DIP, DIP16,.3
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-XDIP-T16
R-GDIP-T16
JESD-609 Code
e0
e0
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.004 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
8 mA
11 mA
Prop. Delay@Nom-Sup
24 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
5
Part Package Code
DIP
Pin Count
16
Family
LS
Length
19.3 mm
Load Capacitance (CL)
15 pF
Number of Outputs
1
Output Polarity
INVERTED
Propagation Delay (tpd)
24 ns
Seated Height-Max
4.19 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Width
7.62 mm
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