S54LS136F
vs
HD74LS86P
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
HITACHI LTD
Package Description
DIP, DIP14,.3
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
LS
JESD-30 Code
R-GDIP-T14
R-PDIP-T14
JESD-609 Code
e0
Load Capacitance (CL)
15 pF
15 pF
Logic IC Type
XOR GATE
XOR GATE
Max I(ol)
0.004 A
0.008 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
75 °C
Operating Temperature-Min
-55 °C
-20 °C
Output Characteristics
OPEN-COLLECTOR
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
10 mA
10 mA
Prop. Delay@Nom-Sup
30 ns
30 ns
Propagation Delay (tpd)
30 ns
30 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
COMMERCIAL EXTENDED
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
Rohs Code
Part Package Code
DIP
Pin Count
14
Length
19.2 mm
Seated Height-Max
5.06 mm
Width
7.62 mm
Compare S54LS136F with alternatives
Compare HD74LS86P with alternatives