S5485W
vs
5485DMQB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
NATIONAL SEMICONDUCTOR CORP
Package Description
DFP, FL16,.3
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-XDFP-F16
R-GDIP-T16
JESD-609 Code
e0
e0
Logic IC Type
MAGNITUDE COMPARATOR
MAGNITUDE COMPARATOR
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
DFP
DIP
Package Equivalence Code
FL16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
FLAT
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
4
Pbfree Code
Part Package Code
DIP
Pin Count
16
Additional Feature
CASCADABLE
Family
TTL/H/L
Length
19.43 mm
Load Capacitance (CL)
15 pF
Number of Bits
4
Number of Functions
1
Output Polarity
TRUE
Power Supply Current-Max (ICC)
88 mA
Propagation Delay (tpd)
30 ns
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Width
7.62 mm
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