S5409F vs MM54HCT08J/883 feature comparison

S5409F NXP Semiconductors

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MM54HCT08J/883 National Semiconductor Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family TTL/H/L HCT
JESD-30 Code R-GDIP-T14 R-GDIP-T14
JESD-609 Code e0 e0
Load Capacitance (CL) 15 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.016 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics OPEN-COLLECTOR
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 26 mA
Prop. Delay@Nom-Sup 32 ns
Propagation Delay (tpd) 24 ns 27 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 2
Rohs Code No
Length 19.43 mm
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm
Width 7.62 mm

Compare S5409F with alternatives

Compare MM54HCT08J/883 with alternatives