S3DB-T3
vs
S3DSMB
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
WON-TOP ELECTRONICS CO LTD
|
DIOTEC SEMICONDUCTOR AG
|
Part Package Code |
DO-214AA
|
|
Package Description |
PLASTIC, SMB, 2 PIN
|
SMB, 2 PIN
|
Pin Count |
2
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Additional Feature |
LOW POWER LOSS
|
|
Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1.2 V
|
1.1 V
|
JEDEC-95 Code |
DO-214AA
|
DO-214AA
|
JESD-30 Code |
R-PDSO-C2
|
R-PDSO-C2
|
JESD-609 Code |
e0
|
e3
|
Non-rep Pk Forward Current-Max |
100 A
|
100 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-65 °C
|
-50 °C
|
Output Current-Max |
3 A
|
3 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Rep Pk Reverse Voltage-Max |
200 V
|
200 V
|
Reverse Recovery Time-Max |
2.5 µs
|
1.5 µs
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN LEAD
|
Matte Tin (Sn) - annealed
|
Terminal Form |
C BEND
|
C BEND
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
1
|
Date Of Intro |
|
2016-05-02
|
Samacsys Manufacturer |
|
Diotec
|
Moisture Sensitivity Level |
|
1
|
Reverse Current-Max |
|
5 µA
|
|
|
|
Compare S3DB-T3 with alternatives
Compare S3DSMB with alternatives