S34MS02G100BHV003 vs S34MS02G100BHI013 feature comparison

S34MS02G100BHV003 Spansion

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S34MS02G100BHI013 Cypress Semiconductor

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer SPANSION INC CYPRESS SEMICONDUCTOR CORP
Package Description BGA-63 BGA-63
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.1.A EAR99
HTS Code 8542.32.00.51 8542.32.00.51
JESD-30 Code R-PBGA-B63 R-PBGA-B63
Length 11 mm 11 mm
Memory Density 2147483648 bit 2147483648 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 63 63
Number of Words 268435456 words 268435456 words
Number of Words Code 256000000 256000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 105 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256MX8 256MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 1.8 V 1.8 V
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type SLC NAND TYPE SLC NAND TYPE
Width 9 mm 9 mm
Base Number Matches 3 2
Rohs Code Yes
Access Time-Max 45 ns
Command User Interface YES
Data Polling NO
Number of Sectors/Size 2K
Package Equivalence Code BGA63,10X12,32
Page Size 2K words
Qualification Status Not Qualified
Ready/Busy YES
Sector Size 128K
Standby Current-Max 0.000045 A
Supply Current-Max 0.02 mA
Toggle Bit NO

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