S34ML04G100BHI010
vs
S34ML04G100BHV010
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
SPANSION INC
SPANSION INC
Package Description
11 X 9 MM, 1 MM HEIGHT, LOW HALOGEN AND LEAD FREE, MO-207M, BGA-63
11 X 9 MM, 1 MM HEIGHT, LOW HALOGEN AND LEAD FREE, MO-207M, BGA-63
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
25 ns
Command User Interface
YES
YES
Common Flash Interface
NO
NO
Data Polling
NO
NO
Data Retention Time-Min
10
10
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
Length
11 mm
11 mm
Memory Density
4294967296 bit
4294967296 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Sectors/Size
4K
Number of Terminals
63
63
Number of Words
536870912 words
536870912 words
Number of Words Code
512000000
512000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512MX8
512MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Equivalence Code
BGA64,10X12,32
BGA64,10X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Page Size
2K words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3.3 V
3.3 V
Qualification Status
Not Qualified
Ready/Busy
YES
Seated Height-Max
1 mm
1 mm
Sector Size
128K
Standby Current-Max
0.00001 A
0.00001 A
Supply Current-Max
0.035 mA
0.035 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
NO
Type
SLC NAND TYPE
SLC NAND TYPE
Width
9 mm
9 mm
Base Number Matches
3
3