S34ML01G200BHI003
vs
S34ML01G200TFV003
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
SPANSION INC
CYPRESS SEMICONDUCTOR CORP
Package Description
BGA-63
TSOP1-48
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.1.A
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Samacsys Manufacturer
Spansion
Access Time-Max
25 ns
Command User Interface
YES
YES
Common Flash Interface
NO
NO
Data Polling
NO
NO
Data Retention Time-Min
10
10
JESD-30 Code
R-PBGA-B63
R-PDSO-G48
Length
11 mm
18.4 mm
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Sectors/Size
1K
Number of Terminals
63
48
Number of Words
134217728 words
134217728 words
Number of Words Code
128000000
128000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128MX8
128MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
TSOP1
Package Equivalence Code
BGA63,10X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
SMALL OUTLINE, THIN PROFILE
Page Size
2K words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3.3 V
3.3 V
Qualification Status
Not Qualified
Ready/Busy
YES
Seated Height-Max
1 mm
1.2 mm
Sector Size
128K
Standby Current-Max
0.00005 A
0.00001 A
Supply Current-Max
0.03 mA
0.035 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
0.8 mm
0.5 mm
Terminal Position
BOTTOM
DUAL
Toggle Bit
NO
Type
SLC NAND TYPE
SLC NAND TYPE
Width
9 mm
12 mm
Write Cycle Time-Max (tWC)
0.000025 ms
Base Number Matches
3
2
JESD-609 Code
e3
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
MATTE TIN