S3170DI
vs
S3160DI
feature comparison
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
APPLIED MICRO CIRCUITS CORP
|
| Package Description |
DIE,
|
DIE, DIE OR CHIP
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-XUUC-N15
|
S-XUUC-N15
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
15
|
15
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIE
|
DIE
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
UPPER
|
UPPER
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
DIE
|
| Pin Count |
|
15
|
| Package Equivalence Code |
|
DIE OR CHIP
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
57 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare S3170DI with alternatives
Compare S3160DI with alternatives