S3160DI
vs
MAX3275U/D
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
APPLIED MICRO CIRCUITS CORP
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
DIE
|
DIE
|
Package Description |
DIE, DIE OR CHIP
|
DIE, DIE OR CHIP
|
Pin Count |
15
|
9
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-XUUC-N15
|
R-XUUC-N9
|
Number of Functions |
1
|
1
|
Number of Terminals |
15
|
9
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
DIE
|
DIE
|
Package Equivalence Code |
DIE OR CHIP
|
DIE OR CHIP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max |
57 mA
|
0.041 mA
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
UPPER
|
UPPER
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e0
|
Technology |
|
BIPOLAR
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare S3160DI with alternatives
Compare MAX3275U/D with alternatives